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Silicon Interposer & Silicon Bridge – Built for Advanced Packaging

We provide silicon-based Interposer and Silicon Bridge packaging solutions that support multi-chip integration and high-density interconnects.

Interposer & Silicon Bridge Solutions

Parameter

Specification

Products

➢ Si Interposer

➢ Si Bridge

➢ Si capacitor

Cap. Integration

➢ Decoupling：2000 nF/mm^2

➢ RF：5 nF/mm^2

Interconnection

➢ fangzhen5 Cu + 1 AL

➢ bump pitch < 40μm

➢ TSV pitch < 50μm

Design and

Simulation

➢ 3D HFSS/EM

➢ Thermal stress

➢ Power integrity

➢ Signal integrity

➢ Power network

➢ Standard HBM3、UCIe2.0

➢ DFT design and reliability

Key Features

· Low RF loss, high thermal conductivity.

· High-density routing supports multi-chip integration.

· Enables vertical interconnects and power delivery.

· Supports signal, power, and ground layer design.

· Compatible with various soldering and bonding processes.

· High-density interconnect, low latency, high signal integrity, customizable design.


Interposer & Silicon Bridge – Silicon Interposer and Silicon Bridge
Packaging Solutions

We provide silicon-based Interposer and Silicon Bridge packaging solutions
that support multi-chip integration and high-density interconnects. Through
Through-Silicon Vias (TSV) and micro-bump technologies, these solutions enable
high-frequency, low-loss signal transmission and power distribution. They are
applicable in advanced packaging, Chiplet design, high-frequency optical
modules, and high-performance computing, offering customers customized, highly
integrated system-level packaging support.

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