UP100 Zero-Halogen Lead-Free Flux for Chip Repair and Soldering

Overview

AiXun UP100 Zero-Halogen Lead-Free Flux is specially formulated for chip repair, PCB rework, component soldering and precision electronic repair applications. Its lead-free and zero-halogen formulation provides an environmentally friendly option for professional soldering and rework operations.

The flux is designed to offer good wetting performance, low smoke and minimal residue during use. It is suitable for a wide range of electronic repair tasks, including mobile phone PCB repair, BGA ball placement and soldering, CPU and LED rework, nano-chip tin plating, SMT repair and component soldering.

UP100 features upgraded PVDC high-barrier packaging that provides strong resistance to moisture, oxidation, fading and aging. The 1 mm stainless steel outlet helps control the amount of flux applied while reducing the risk of clogging, making it convenient for detailed chip-level repair work.

Key Features

Zero-Halogen and Lead-Free Formula

UP100 uses a specially developed lead-free and zero-halogen formula for electronic repair and soldering applications. It provides a cleaner alternative for users looking for environmentally friendly flux for chip repair and PCB rework.

Good Wetting Performance

The flux provides good wetting properties to help solder spread effectively across the target area. This makes it suitable for component soldering, chip repair and rework where controlled soldering performance is required.

Low Smoke and Minimal Residue

During normal soldering operations, UP100 produces minimal smoke and no pungent odor. Its formulation is designed to leave little to no residue and help maintain a cleaner working area after soldering.

1 mm Anti-Clogging Outlet

The stainless steel 1 mm outlet allows users to apply flux precisely to small soldering areas. Its narrow opening helps control dispensing and reduces the possibility of clogging during repeated use.

High-Barrier PVDC Packaging

The upgraded PVDC packaging provides enhanced protection against moisture and oxidation. It also helps reduce the risk of leakage, fading, aging and material separation during storage and transportation.

Suitable for Precision Electronics Repair

UP100 can be used for mobile phone PCB repair, BGA ball placement, chip soldering, SMT rework, component soldering, CPU and LED rework, nano-chip tin plating and other electronic repair applications.

Specifications

Applications

UP100 is developed for various electronic repair and soldering applications where precise flux dispensing and clean soldering performance are important.

• Mobile Phone PCB Repair – Suitable for repairing solder joints and electronic components on mobile phone circuit boards.

• BGA Chip Repair – Supports BGA ball placement, chip bonding and soldering during electronic rework.

• Chip Soldering – Suitable for precision soldering of chips and small electronic components.

• SMT Repair – Can be used for SMT component rework and soldering operations.

• Component Soldering – Suitable for soldering various electronic components and repairing poor solder joints.

• CPU and LED Rework – Applicable to CPU, LED and other electronic component rework applications.

• Nano-Chip Tin Plating – Suitable for controlled flux application during fine-pitch and nano-chip soldering work.

• Cold Solder Joint Repair – Helps support rework of cold solder joints and other soldering defects.

Packaging

Each UP100 package contains 1 tube of Zero-Halogen Lead-Free Flux.

Packing Details:

• 1 tube / box

• 100 boxes / carton

• Box Dimensions: 11.2 × 3 × 1 cm

• Carton Dimensions: 56 × 31 × 20 cm

• Individual Product Size: 11.1 × 3 cm

• Net Weight: 10 ml / tube

The PVDC high-barrier packaging is designed to provide additional protection against moisture and oxidation during storage and transportation.

Why Choose AiXun UP100?

AiXun UP100 combines a lead-free, zero-halogen formula with precise dispensing and protective packaging to meet the practical needs of electronic repair technicians and soldering professionals.

Its 1 mm outlet makes it easier to apply a controlled amount of flux to small soldering areas, while the good wetting performance supports chip and component rework. The low-smoke formulation and minimal residue also help create a cleaner working environment.

For distributors, repair equipment suppliers and electronics service providers, UP100 offers a practical flux solution for mobile phone repair, PCB rework, BGA applications and general electronic soldering.

FAQ

1. What is AiXun UP100 flux used for?

AiXun UP100 is a zero-halogen lead-free flux designed for chip repair, PCB rework, BGA ball placement, component soldering, SMT repair and other electronic soldering applications.

2. Is UP100 flux lead-free?

Yes. UP100 uses a lead-free formulation and is specifically developed as a zero-halogen lead-free flux for electronic repair and soldering.

3. What is the outlet diameter of UP100?

The product uses a 1 mm stainless steel outlet, which allows more precise flux dispensing for small electronic components and chip-level repair.

4. Can UP100 be used for BGA repair?

Yes. UP100 is suitable for BGA ball placement, chip bonding and soldering applications and can be used during BGA repair and rework.

5. What color is UP100 flux?

The flux paste is milky white.

6. How much flux is contained in one tube?

Each tube contains 10 ml of flux.

7. How should UP100 be stored?

It should be stored in a cool indoor place, away from excessive heat, moisture and direct exposure to unsuitable storage conditions.

8. What types of electronics can be repaired with UP100?

UP100 is suitable for applications including mobile phone PCBs, BGA chips, CPUs, LEDs, SMT components and other electronic components requiring soldering or rework.