Medium sized vacuum plasma equipment（PM180L ， PM216L）
High precision, fast response, good handling and compatibility, perfect functions and professional technical support.
Medium sized vacuum plasma equipment（PM180L ， PM216L）
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Number |
Project |
Technical parameter |
|
1 |
Machine specifications |
PM180L：1400(W) ×1720(H)×1050(D)mm PM216L：1450(W) ×1720(H)×1150(D)mm |
|
2 |
Vacuum chamber specifications |
PM180L：Imported aluminum 550(W)×680(H)×500(D)mm PM216L：Imported aluminum 600(W)×600(H)×600(D)mm |
|
3 |
Electrode plate specifications |
PM180L：10 layer flat electrode（530(L)×400(W)mm）Can customized PM216L：10 layer flat electrode（560(W)×500(D)mm）Can customized |
|
4 |
control system |
Touch screen + PLC control |
|
5 |
Vacuum measurement system |
Pirani resistance vacuum gauge |
|
6 |
Gas metering system |
Accurate mass flow controllersMFC |
|
7 |
Number of gas pathways |
2-way intake, 1-way exhaust |
|
8 |
Plasma Generator |
5KWPlasma generation source，40KHz（selectable 13.56MHz） |
|
9 |
working gas |
2 working gases are optional：Ar2、N2、H2、O2 |
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Features |
High precision, fast response, good handling and compatibility, perfect functions and professional technical support. |
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|
Industry |
Suitable for camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. |
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|
Application |
1. Camera and fingerprint recognition industry: deoxidation of the gold PAD surface of rigid-flex boards; IR surface cleaning and cleaning; 2. Semiconductor IC field: COB, COG, COF, ACF process, used for wire bonding, cleaning before soldering; 3. Silicone, plastic, polymer field: silica gel, plastic, polymer surface roughening, etching, activation. |
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